Phoenix Contact MCDN Series Through Hole PCB Header, 6 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

The Phoenix Contact MCDN 1.5/3-G1-3.81 P14THR is a high-quality PCB header designed for effective integration into various electronic devices. This versatile component boasts a linear pinning layout and is specifically suitable for through hole reflow soldering, catering to a range of connection technologies. Its robust construction and thoughtful design enable higher contact density while allowing maximum flexibility in device design. The product ranges in applications requiring reliable electrical connections, making it essential for contemporary electronic assemblies. With a nominal current capacity of 8 A and a rated voltage of up to 160 V, this PCB header ensures dependable and safe operation across diverse environments, from offices to industrial settings. Moreover, the innovative design affords effortless assembly and durability, positioning it as an ideal choice for manufacturers seeking quality and performance.

The Phoenix Contact MCDN 1.5/3-G1-3.81 P14THR is a high-quality PCB header designed for effective integration into various electronic devices. This versatile component boasts a linear pinning layout and is specifically suitable for through hole reflow soldering, catering to a range of connection technologies. Its robust construction and thoughtful design enable higher contact density while allowing maximum flexibility in device design. The product ranges in applications requiring reliable electrical connections, making it essential for contemporary electronic assemblies. With a nominal current capacity of 8 A and a rated voltage of up to 160 V, this PCB header ensures dependable and safe operation across diverse environments, from offices to industrial settings. Moreover, the innovative design affords effortless assembly and durability, positioning it as an ideal choice for manufacturers seeking quality and performance.

Designed for seamless integration into the SMT soldering processAllows for enhanced flexibility in device configurations and layoutManufactured to meet stringent quality standards for reliabilityAccommodates multiple connection technologies for diverse applicationsFeatures a compact design that facilitates higher density connectionsEnsures efficient heat management during the soldering processConstructed with materials that comply with WEEE and RoHS regulationsProvides a moisture-sensitive level rating for safe handlingSupports a wide operating temperature range for versatile applications

Designed for seamless integration into the SMT soldering process

Allows for enhanced flexibility in device configurations and layout

Allows for enhanced flexibility in device configurations and layout

Manufactured to meet stringent quality standards for reliability

Manufactured to meet stringent quality standards for reliability

Accommodates multiple connection technologies for diverse applications

Accommodates multiple connection technologies for diverse applications

Features a compact design that facilitates higher density connections

Features a compact design that facilitates higher density connections

Ensures efficient heat management during the soldering process

Ensures efficient heat management during the soldering process

Constructed with materials that comply with WEEE and RoHS regulations

Constructed with materials that comply with WEEE and RoHS regulations

Provides a moisture-sensitive level rating for safe handling

Provides a moisture-sensitive level rating for safe handling

Supports a wide operating temperature range for versatile applications

Supports a wide operating temperature range for versatile applications