Phoenix Contact IPCV Series Wave Soldering Mount PCB Header, 8 Contact(s), 10.16 mm Pitch, 1 Row, Shrouded

The Phoenix Contact PCB header, designed within the IPCV range, epitomises versatility and reliability for electronic connections. Tailored for seamless integration, it offers a compact solution with linear pinning and a pitch of 10.16 mm, ensuring easy installations. Its robust construction is complemented by the electroplated silver surface that enhances conductivity and resilience, providing secure connections for longevity. With a distinctive inverted design, it not only meets rigorous industry standards but also offers touch-proof device outputs, enhancing the safety of your applications. The header is engineered to handle demanding tasks, featuring a nominal current capacity of 76 A and a rated voltage of 1000 V. This product is particularly suited for wave soldering processes, making it an ideal choice for manufacturers looking to streamline their assembly lines.

The Phoenix Contact PCB header, designed within the IPCV range, epitomises versatility and reliability for electronic connections. Tailored for seamless integration, it offers a compact solution with linear pinning and a pitch of 10.16 mm, ensuring easy installations. Its robust construction is complemented by the electroplated silver surface that enhances conductivity and resilience, providing secure connections for longevity. With a distinctive inverted design, it not only meets rigorous industry standards but also offers touch-proof device outputs, enhancing the safety of your applications. The header is engineered to handle demanding tasks, featuring a nominal current capacity of 76 A and a rated voltage of 1000 V. This product is particularly suited for wave soldering processes, making it an ideal choice for manufacturers looking to streamline their assembly lines.

Designed for easy integration and reliable performanceInverted design for added safety in device output connectionsElectroplated silver surface for improved conductivitySupports wave soldering for efficient assemblyRobust construction ensures durability under varying conditionsOptimised for use with a variety of connection technologies

Designed for easy integration and reliable performance

Inverted design for added safety in device output connections

Inverted design for added safety in device output connections

Electroplated silver surface for improved conductivity

Electroplated silver surface for improved conductivity

Supports wave soldering for efficient assembly

Supports wave soldering for efficient assembly

Robust construction ensures durability under varying conditions

Robust construction ensures durability under varying conditions

Optimised for use with a variety of connection technologies

Optimised for use with a variety of connection technologies