TE Connectivity AMPMODU System 50 Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB mount header represents a pinnacle of engineering designed for reliable board-to-board connections. Manufactured with precision, it features a compact and efficient configuration, making it an ideal choice for applications where space is at a premium. The vertical orientation accommodates 80 positions, ensuring optimal connectivity capabilities while maintaining a sleek profile. Its robust construction with quality materials guarantees durability and performance in demanding environments. The golden contacts further enhance conductivity, making this component suitable for high-frequency applications. With a 1.27 mm centreline pitch, it adheres to the highest industry standards while offering remarkable electrical and thermal characteristics. The product is equipped to withstand a wide range of temperatures, making it highly versatile across various industries, from telecommunications to automotive.

The TE Connectivity PCB mount header represents a pinnacle of engineering designed for reliable board-to-board connections. Manufactured with precision, it features a compact and efficient configuration, making it an ideal choice for applications where space is at a premium. The vertical orientation accommodates 80 positions, ensuring optimal connectivity capabilities while maintaining a sleek profile. Its robust construction with quality materials guarantees durability and performance in demanding environments. The golden contacts further enhance conductivity, making this component suitable for high-frequency applications. With a 1.27 mm centreline pitch, it adheres to the highest industry standards while offering remarkable electrical and thermal characteristics. The product is equipped to withstand a wide range of temperatures, making it highly versatile across various industries, from telecommunications to automotive.

Boasts an unshrouded design for maximum flexibility in designEnables through hole solder termination for enhanced stabilityConstructed from LCP material for high temperature applicationsMaintains a high insulation resistance to ensure signal integritySupporting a wide operating temperature range for diverse applicationsEmbraces a low halogen content for environmentally friendly compliance

Boasts an unshrouded design for maximum flexibility in design

Enables through hole solder termination for enhanced stability

Enables through hole solder termination for enhanced stability

Constructed from LCP material for high temperature applications

Constructed from LCP material for high temperature applications

Maintains a high insulation resistance to ensure signal integrity

Maintains a high insulation resistance to ensure signal integrity

Supporting a wide operating temperature range for diverse applications

Supporting a wide operating temperature range for diverse applications

Embraces a low halogen content for environmentally friendly compliance

Embraces a low halogen content for environmentally friendly compliance