TE Connectivity Z-PACK Series Vertical Board PCB Header, 96 Contact(s), 1.9 mm Pitch, 12 Row, Shrouded

The TE Connectivity 96 Position High Speed Backplane Connector is designed for demanding applications, offering exceptional reliability and performance. Engineered with 12 rows and 8 columns, this PCB mount header provides a fully shrouded connection that ensures maximum signal integrity. The advanced Z-PACK TinMan technology enables excellent electrical performance, making it ideal for high-speed data communication. Its robust design accommodates a 1.9 mm centreline, while maintaining a compact footprint suitable for space-constrained environments. With features tailored for both functionality and ease of use, this connector is the perfect solution for traditional backplane architectures, ensuring seamless integration in modern electronic systems.

The TE Connectivity 96 Position High Speed Backplane Connector is designed for demanding applications, offering exceptional reliability and performance. Engineered with 12 rows and 8 columns, this PCB mount header provides a fully shrouded connection that ensures maximum signal integrity. The advanced Z-PACK TinMan technology enables excellent electrical performance, making it ideal for high-speed data communication. Its robust design accommodates a 1.9 mm centreline, while maintaining a compact footprint suitable for space-constrained environments. With features tailored for both functionality and ease of use, this connector is the perfect solution for traditional backplane architectures, ensuring seamless integration in modern electronic systems.

Designed for high-speed data transmission at data rates up to 10 Gb/sFeatures a guide slot for precise mating alignment and improved reliabilityConstructed with durable materials to withstand operating temperatures from -65 to 90 °COffers effective signal arrangement for differential pairs, enhancing performanceIncludes through-hole press-fit termination for robust PCB connectionsSupports a traditional backplane architecture for versatile applicationsMatte finish plating enhances durability and reduces wear over timeLow halogen content ensures compliance with environmental standardsVertical PCB mount orientation allows for efficient use of space in layouts

Designed for high-speed data transmission at data rates up to 10 Gb/s

Features a guide slot for precise mating alignment and improved reliability

Features a guide slot for precise mating alignment and improved reliability

Constructed with durable materials to withstand operating temperatures from -65 to 90 °C

Constructed with durable materials to withstand operating temperatures from -65 to 90 °C

Offers effective signal arrangement for differential pairs, enhancing performance

Offers effective signal arrangement for differential pairs, enhancing performance

Includes through-hole press-fit termination for robust PCB connections

Includes through-hole press-fit termination for robust PCB connections

Supports a traditional backplane architecture for versatile applications

Supports a traditional backplane architecture for versatile applications

Matte finish plating enhances durability and reduces wear over time

Matte finish plating enhances durability and reduces wear over time

Low halogen content ensures compliance with environmental standards

Low halogen content ensures compliance with environmental standards

Vertical PCB mount orientation allows for efficient use of space in layouts

Vertical PCB mount orientation allows for efficient use of space in layouts