TE Connectivity Fortis Zd Series Right Angle Panel PCB Header, 180 Contact(s), 0.08 mm Pitch, 9 Row, Shrouded

The TE Connectivity High-speed backplane connector offers cutting-edge connectivity solutions for intricate electronic systems. Designed with nine rows and twenty columns, it provides a robust interface for PCB mounting, ensuring secure connections even in high-density applications. The fully shrouded right-angle header facilitates efficient space utilisation while protecting against accidental disconnections. Built to withstand a wide operating temperature range, this connector is optimal for diverse environments, promoting reliability in all conditions. Its lightweight construction combined with low contact current rating makes it a perfect fit for modern electronics, where precision and performance are paramount. The product embodies a symbiosis of advanced engineering and practical application, marked to enhance the efficiency of your electronic assemblies.

The TE Connectivity High-speed backplane connector offers cutting-edge connectivity solutions for intricate electronic systems. Designed with nine rows and twenty columns, it provides a robust interface for PCB mounting, ensuring secure connections even in high-density applications. The fully shrouded right-angle header facilitates efficient space utilisation while protecting against accidental disconnections. Built to withstand a wide operating temperature range, this connector is optimal for diverse environments, promoting reliability in all conditions. Its lightweight construction combined with low contact current rating makes it a perfect fit for modern electronics, where precision and performance are paramount. The product embodies a symbiosis of advanced engineering and practical application, marked to enhance the efficiency of your electronic assemblies.

Provides reliable signal integrity for demanding applicationsCompact design promotes maximum utilisation of space in electronic layoutsFully shrouded for enhanced protection against environmental factorsCompatible with both traditional and advanced backplane architecturesFacilitates efficient thermal management due to its unique designOffers versatility in various electronic assemblies and configurationsOptimal for high-density arrangements in complex circuits

Provides reliable signal integrity for demanding applications

Compact design promotes maximum utilisation of space in electronic layouts

Compact design promotes maximum utilisation of space in electronic layouts

Fully shrouded for enhanced protection against environmental factors

Fully shrouded for enhanced protection against environmental factors

Compatible with both traditional and advanced backplane architectures

Compatible with both traditional and advanced backplane architectures

Facilitates efficient thermal management due to its unique design

Facilitates efficient thermal management due to its unique design

Offers versatility in various electronic assemblies and configurations

Offers versatility in various electronic assemblies and configurations

Optimal for high-density arrangements in complex circuits

Optimal for high-density arrangements in complex circuits