TE Connectivity AMPMODU Series Vertical Board PCB Header, 50 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB mount header is designed for reliable board-to-board connections, ensuring exceptional performance in a compact form factor. With a vertical orientation and fully shrouded design, this connector accommodates a substantial 50 positions, making it ideal for intricate electronic applications. The robust construction features thermoplastic housing and gold-plated contacts that deliver durability and superior conductivity. Operating across a wide temperature range of -65 to 105 °C, it caters to diverse environments, while the through-hole solder termination method simplifies the assembly process. This connector epitomises innovation in connectivity solutions, empowering engineers to optimise space and enhance signal integrity in their designs.

The TE Connectivity PCB mount header is designed for reliable board-to-board connections, ensuring exceptional performance in a compact form factor. With a vertical orientation and fully shrouded design, this connector accommodates a substantial 50 positions, making it ideal for intricate electronic applications. The robust construction features thermoplastic housing and gold-plated contacts that deliver durability and superior conductivity. Operating across a wide temperature range of -65 to 105 °C, it caters to diverse environments, while the through-hole solder termination method simplifies the assembly process. This connector epitomises innovation in connectivity solutions, empowering engineers to optimise space and enhance signal integrity in their designs.

Designed specifically for board-to-board applicationsEnsures robust and secure connections with a fully shrouded designFacilitates straightforward installation through a through-hole solder methodOffers compatibility with various printed circuit board thicknessesShowcases polarisation features for accurate alignment during matingConstructed for high-density layouts without compromising performanceFeatures nickel underplating for enhanced overall durabilityComplies with industry standards for quality and safety

Designed specifically for board-to-board applications

Ensures robust and secure connections with a fully shrouded design

Ensures robust and secure connections with a fully shrouded design

Facilitates straightforward installation through a through-hole solder method

Facilitates straightforward installation through a through-hole solder method

Offers compatibility with various printed circuit board thicknesses

Offers compatibility with various printed circuit board thicknesses

Showcases polarisation features for accurate alignment during mating

Showcases polarisation features for accurate alignment during mating

Constructed for high-density layouts without compromising performance

Constructed for high-density layouts without compromising performance

Features nickel underplating for enhanced overall durability

Features nickel underplating for enhanced overall durability

Complies with industry standards for quality and safety

Complies with industry standards for quality and safety