TE Connectivity AMPMODU Series Right Angle PCB PCB Header, 14 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB Mount Header is designed to provide an efficient and reliable solution for board-to-board connectivity. Its right-angle configuration and breakaway feature allow for versatile applications, making it ideal for various electronic assemblies. Crafted with precision, this product ensures a seamless connection, elevating performance in compact spaces. The gold plating on the contacts enhances conductivity, while the robust construction guarantees durability even in demanding environments. Designed for ease of use, it supports through-hole soldering, ensuring secure attachment to printed circuit boards. This header represents a pinnacle of reliability, ready to meet the stringent demands of modern electronics.

The TE Connectivity PCB Mount Header is designed to provide an efficient and reliable solution for board-to-board connectivity. Its right-angle configuration and breakaway feature allow for versatile applications, making it ideal for various electronic assemblies. Crafted with precision, this product ensures a seamless connection, elevating performance in compact spaces. The gold plating on the contacts enhances conductivity, while the robust construction guarantees durability even in demanding environments. Designed for ease of use, it supports through-hole soldering, ensuring secure attachment to printed circuit boards. This header represents a pinnacle of reliability, ready to meet the stringent demands of modern electronics.

Breakaway design offers flexible configurationsCompatible with a variety of PCB layoutsHigh temperature rating ensures performance stabilityOptimised for board to board applicationsNickel underplating provides added durabilitySquare contact shape allows for efficient matingLow profile design enhances spatial efficiency

Breakaway design offers flexible configurations

Compatible with a variety of PCB layouts

Compatible with a variety of PCB layouts

High temperature rating ensures performance stability

High temperature rating ensures performance stability

Optimised for board to board applications

Optimised for board to board applications

Nickel underplating provides added durability

Nickel underplating provides added durability

Square contact shape allows for efficient mating

Square contact shape allows for efficient mating

Low profile design enhances spatial efficiency

Low profile design enhances spatial efficiency