TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB Mount Header is a cutting-edge component designed for vertical board-to-board connections, ensuring a robust and reliable interface in electronic applications. With a sleek 80-position configuration and a compact 1.27 mm centreline pitch, it is engineered for optimal space efficiency without compromising performance. Fully shrouded for enhanced protection, this connector is detailed with gold plating to ensure excellent conductivity and durability. Operating with an impressive voltage of up to 30 VAC, it is built to withstand various environmental conditions, making it an ideal choice for demanding applications. The header is compatible with wave soldering processes, further enhancing its adaptability in assembly lines. With a temperature range that ensures reliability even in extreme conditions, this product stands as a testament to quality and innovation in connection technology.

The TE Connectivity PCB Mount Header is a cutting-edge component designed for vertical board-to-board connections, ensuring a robust and reliable interface in electronic applications. With a sleek 80-position configuration and a compact 1.27 mm centreline pitch, it is engineered for optimal space efficiency without compromising performance. Fully shrouded for enhanced protection, this connector is detailed with gold plating to ensure excellent conductivity and durability. Operating with an impressive voltage of up to 30 VAC, it is built to withstand various environmental conditions, making it an ideal choice for demanding applications. The header is compatible with wave soldering processes, further enhancing its adaptability in assembly lines. With a temperature range that ensures reliability even in extreme conditions, this product stands as a testament to quality and innovation in connection technology.

Designed for board to board applications ensuring reliable connectionsFully shrouded header provides additional protection against mechanical damageHigh quality gold plating guarantees superior conductivitySimple integration with wave solder processes enhances assembly efficiencyMating retention feature ensures secure connectionsLCP housing material offers excellent thermal and electrical performanceCertifications for compliance with various industry standards enhance reliability

Designed for board to board applications ensuring reliable connections

Fully shrouded header provides additional protection against mechanical damage

Fully shrouded header provides additional protection against mechanical damage

High quality gold plating guarantees superior conductivity

High quality gold plating guarantees superior conductivity

Simple integration with wave solder processes enhances assembly efficiency

Simple integration with wave solder processes enhances assembly efficiency

Mating retention feature ensures secure connections

Mating retention feature ensures secure connections

LCP housing material offers excellent thermal and electrical performance

LCP housing material offers excellent thermal and electrical performance

Certifications for compliance with various industry standards enhance reliability

Certifications for compliance with various industry standards enhance reliability