TE Connectivity AMPMODU Series Vertical Board PCB Header, 40 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB Mount Header is an innovative solution designed for vertical, board-to-board connectivity. This component seamlessly integrates with a variety of circuit applications, ensuring reliable performance and efficiency. Its unshrouded header type allows for easy mating with other connectors, offering versatility in different circuit designs, while maintaining a compact footprint. With a 40-position layout and a 2.54 mm centerline, it caters to high-density configurations, making it ideal for space-constrained applications. The robust construction features gold plating for optimum conductivity and durability, ensuring long-lasting connection integrity. Enhanced insulation resistance and dielectric withstand capabilities position this header as a standout choice for contemporary electronic assemblies, while the thermoplastic housing withstands various operational demands.

The TE Connectivity PCB Mount Header is an innovative solution designed for vertical, board-to-board connectivity. This component seamlessly integrates with a variety of circuit applications, ensuring reliable performance and efficiency. Its unshrouded header type allows for easy mating with other connectors, offering versatility in different circuit designs, while maintaining a compact footprint. With a 40-position layout and a 2.54 mm centerline, it caters to high-density configurations, making it ideal for space-constrained applications. The robust construction features gold plating for optimum conductivity and durability, ensuring long-lasting connection integrity. Enhanced insulation resistance and dielectric withstand capabilities position this header as a standout choice for contemporary electronic assemblies, while the thermoplastic housing withstands various operational demands.

Designed for board-to-board configurations, simplifying connections between PCBsOptimized for high-density designs, perfect for compact electronic devicesUnshrouded design facilitates easier mating with compatible connectorsGold plating enhances conductivity, ensuring reliable performanceRobust thermoplastic housing guarantees durability under various conditions

Designed for board-to-board configurations, simplifying connections between PCBs

Optimized for high-density designs, perfect for compact electronic devices

Optimized for high-density designs, perfect for compact electronic devices

Unshrouded design facilitates easier mating with compatible connectors

Unshrouded design facilitates easier mating with compatible connectors

Gold plating enhances conductivity, ensuring reliable performance

Gold plating enhances conductivity, ensuring reliable performance

Robust thermoplastic housing guarantees durability under various conditions

Robust thermoplastic housing guarantees durability under various conditions