TE Connectivity AMPMODU Series Vertical PCB PCB Header, 4 Contact(s), 2 mm Pitch, 1 Row, Unshrouded

The TE Connectivity PCB Mount Header is engineered for exceptional reliability and performance in board-to-board applications. This vertical connector stands out with its breakaway design, allowing for easy assembly and versatility in configuration. With 4 positions and a compact 2 mm centerline, it efficiently manages space without sacrificing functionality. Constructed with premium materials, including thermoplastic and gold plating for contacts, it promises durability and long-lasting connections. The device is ideal for a wide range of applications, particularly where signal integrity is paramount. Its compatibility with standardized practices ensures that this product integrates seamlessly into existing designs, thereby enhancing productivity and reliability across various sectors. Designed to meet high operational demands, this connector can withstand considerable environmental challenges, providing peace of mind for engineers and designers alike.

The TE Connectivity PCB Mount Header is engineered for exceptional reliability and performance in board-to-board applications. This vertical connector stands out with its breakaway design, allowing for easy assembly and versatility in configuration. With 4 positions and a compact 2 mm centerline, it efficiently manages space without sacrificing functionality. Constructed with premium materials, including thermoplastic and gold plating for contacts, it promises durability and long-lasting connections. The device is ideal for a wide range of applications, particularly where signal integrity is paramount. Its compatibility with standardized practices ensures that this product integrates seamlessly into existing designs, thereby enhancing productivity and reliability across various sectors. Designed to meet high operational demands, this connector can withstand considerable environmental challenges, providing peace of mind for engineers and designers alike.

Enables efficient board-to-board connectivityUtilizes gold plating to enhance electrical conductivityBreakaway feature simplifies assembly and flexibilityThermoplastic housing offers robust thermal performanceExcellent dielectric withstand capabilities ensure reliability

Enables efficient board-to-board connectivity

Utilizes gold plating to enhance electrical conductivity

Utilizes gold plating to enhance electrical conductivity

Breakaway feature simplifies assembly and flexibility

Breakaway feature simplifies assembly and flexibility

Thermoplastic housing offers robust thermal performance

Thermoplastic housing offers robust thermal performance

Excellent dielectric withstand capabilities ensure reliability

Excellent dielectric withstand capabilities ensure reliability