Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 6 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

The Phoenix Contact PCB header is designed specifically for flexibility in device architecture, allowing for integration into various through-hole reflow processes. It features a robust construction that ensures an optimum fit on printed circuit boards. With a pitch of 3.81 mm, it can efficiently accommodate a high number of connections in a compact space, making it ideal for applications with stringent design requirements. This component not only guarantees reliable electrical performance with a nominal current handling capacity of 8 A but also supports a rated voltage of 160 V, ensuring safe operation in various conditions. Its durable design, featuring a tin-plated surface, promotes enhanced connectivity while resisting corrosion. Perfect for devices where space can be a constraint, it embodies the perfect blend of efficiency and reliability.

The Phoenix Contact PCB header is designed specifically for flexibility in device architecture, allowing for integration into various through-hole reflow processes. It features a robust construction that ensures an optimum fit on printed circuit boards. With a pitch of 3.81 mm, it can efficiently accommodate a high number of connections in a compact space, making it ideal for applications with stringent design requirements. This component not only guarantees reliable electrical performance with a nominal current handling capacity of 8 A but also supports a rated voltage of 160 V, ensuring safe operation in various conditions. Its durable design, featuring a tin-plated surface, promotes enhanced connectivity while resisting corrosion. Perfect for devices where space can be a constraint, it embodies the perfect blend of efficiency and reliability.

Designed for seamless integration into SMT soldering processesSupports vertical connections, allowing for multi-row arrangements on PCBsOffers maximum design flexibility with compatibility across different connection technologiesUtilises a linear pin layout for straightforward installationsFeatures a moisture-sensitive design rated at MSL 1 for dependable performanceConstructed to be WEEE/RoHS-compliant, promoting eco-friendlinessAble to withstand harsh environmental conditions, including extreme temperaturesOptimised for both reflow and wave soldering applicationsEnsures consistent quality with thorough electrical and mechanical testingLightweight packaging reduces transport costs while ensuring protection during shipping

Designed for seamless integration into SMT soldering processes

Supports vertical connections, allowing for multi-row arrangements on PCBs

Supports vertical connections, allowing for multi-row arrangements on PCBs

Offers maximum design flexibility with compatibility across different connection technologies

Offers maximum design flexibility with compatibility across different connection technologies

Utilises a linear pin layout for straightforward installations

Utilises a linear pin layout for straightforward installations

Features a moisture-sensitive design rated at MSL 1 for dependable performance

Features a moisture-sensitive design rated at MSL 1 for dependable performance

Constructed to be WEEE/RoHS-compliant, promoting eco-friendliness

Constructed to be WEEE/RoHS-compliant, promoting eco-friendliness

Able to withstand harsh environmental conditions, including extreme temperatures

Able to withstand harsh environmental conditions, including extreme temperatures

Optimised for both reflow and wave soldering applications

Optimised for both reflow and wave soldering applications

Ensures consistent quality with thorough electrical and mechanical testing

Ensures consistent quality with thorough electrical and mechanical testing

Lightweight packaging reduces transport costs while ensuring protection during shipping

Lightweight packaging reduces transport costs while ensuring protection during shipping