TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The TE Connectivity PCB Mount Header is designed for vertical, board-to-board applications, providing an efficient connection solution with 12 positions supported on a compact 2.54 mm centreline. Ideal for high-density assembly, the breakaway design facilitates easy customisation and integration into your PCB layout. Built to withstand operational challenges, it features gold-plated contacts that enhance durability while ensuring optimal conductivity. With a robust construction that includes thermoplastic housing and nickel underplating, this component meets industry standards for performance and reliability, making it essential for a variety of electronic applications.

The TE Connectivity PCB Mount Header is designed for vertical, board-to-board applications, providing an efficient connection solution with 12 positions supported on a compact 2.54 mm centreline. Ideal for high-density assembly, the breakaway design facilitates easy customisation and integration into your PCB layout. Built to withstand operational challenges, it features gold-plated contacts that enhance durability while ensuring optimal conductivity. With a robust construction that includes thermoplastic housing and nickel underplating, this component meets industry standards for performance and reliability, making it essential for a variety of electronic applications.

Optimised for board-to-board connectivity to maximise space efficiencyDesigned for ease of assembly, reducing installation timeHigh current rating ensures reliable performance in demanding conditionsThermoplastic housing offers resilience against environmental stressBreakaway configuration allows for tailored setups as neededCompatible with various industry standards for universal applicabilityCapable of enduring high operating temperatures for flexible usageLow bromine content contributes to cleaner manufacturing processesCompliant with international directives, ensuring peace of mind in usage

Optimised for board-to-board connectivity to maximise space efficiency

Designed for ease of assembly, reducing installation time

Designed for ease of assembly, reducing installation time

High current rating ensures reliable performance in demanding conditions

High current rating ensures reliable performance in demanding conditions

Thermoplastic housing offers resilience against environmental stress

Thermoplastic housing offers resilience against environmental stress

Breakaway configuration allows for tailored setups as needed

Breakaway configuration allows for tailored setups as needed

Compatible with various industry standards for universal applicability

Compatible with various industry standards for universal applicability

Capable of enduring high operating temperatures for flexible usage

Capable of enduring high operating temperatures for flexible usage

Low bromine content contributes to cleaner manufacturing processes

Low bromine content contributes to cleaner manufacturing processes

Compliant with international directives, ensuring peace of mind in usage

Compliant with international directives, ensuring peace of mind in usage