Phoenix Contact DMC Series Straight Solder PCB Header, 18 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

The Phoenix Contact DMC 1.5/9-G1F-3.5-LR P26THR is a highly versatile PCB header designed for seamless integration into PCB assemblies. This connector exemplifies robustness and efficiency, making it ideal for applications within compact electronic devices. With a nominal current capacity of 8 A and multiple connection potentials, it ensures reliable performance in demanding environments. The clever design alleviates space concerns, allowing for maximum contact density while facilitating easy installation through THR soldering. Its intelligently engineered features promote stability, making it an ideal component for a variety of industrial applications.

The Phoenix Contact DMC 1.5/9-G1F-3.5-LR P26THR is a highly versatile PCB header designed for seamless integration into PCB assemblies. This connector exemplifies robustness and efficiency, making it ideal for applications within compact electronic devices. With a nominal current capacity of 8 A and multiple connection potentials, it ensures reliable performance in demanding environments. The clever design alleviates space concerns, allowing for maximum contact density while facilitating easy installation through THR soldering. Its intelligently engineered features promote stability, making it an ideal component for a variety of industrial applications.

Designed for enhanced mechanical stability with a screwable flangeIntuitive 'Lock and Release' mechanism simplifies connection and disconnectionOptimised for SMT soldering processes, streamlining assembly efficiencyThe compact form factor accommodates space-constrained applications effortlesslyManufactured from high-quality materials ensuring compliance with WEEE and RoHS regulationsSuitable for high-temperature applications with a classification temperature of 260 °C

Designed for enhanced mechanical stability with a screwable flange

Intuitive 'Lock and Release' mechanism simplifies connection and disconnection

Intuitive 'Lock and Release' mechanism simplifies connection and disconnection

Optimised for SMT soldering processes, streamlining assembly efficiency

Optimised for SMT soldering processes, streamlining assembly efficiency

The compact form factor accommodates space-constrained applications effortlessly

The compact form factor accommodates space-constrained applications effortlessly

Manufactured from high-quality materials ensuring compliance with WEEE and RoHS regulations

Manufactured from high-quality materials ensuring compliance with WEEE and RoHS regulations

Suitable for high-temperature applications with a classification temperature of 260 °C

Suitable for high-temperature applications with a classification temperature of 260 °C