TE Connectivity AMPMODU Series Vertical Board PCB Header, 3 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded

The TE Connectivity PCB mount header is designed for vertical wire-to-board applications, offering an efficient solution for interconnections in electronic devices. Fully shrouded and equipped with three positions, it facilitates secure connections, enhancing reliability in various applications. The component features a compact 2.5 mm centreline, making it ideal for space-constrained designs. Constructed with durable materials, it comes with a tin-plated finish and is suitable for through-hole soldering. This header excels in both electrical performance and mechanical stability, ensuring optimal functionality in demanding environments.

The TE Connectivity PCB mount header is designed for vertical wire-to-board applications, offering an efficient solution for interconnections in electronic devices. Fully shrouded and equipped with three positions, it facilitates secure connections, enhancing reliability in various applications. The component features a compact 2.5 mm centreline, making it ideal for space-constrained designs. Constructed with durable materials, it comes with a tin-plated finish and is suitable for through-hole soldering. This header excels in both electrical performance and mechanical stability, ensuring optimal functionality in demanding environments.

Offers a reliable connection for signal applicationsComposed of robust PA 66 GF housing material for enhanced durabilityFeatures a mating retention latch for secure connectionsDesigned for operational temperatures ranging from -40 to 120 °CIncorporates inner alignment features to prevent misalignment during connectionEnsures compatibility with a range of related components and accessoriesProvides easy installation with through-hole solder termination methodSustainably manufactured to comply with EU RoHS regulations

Offers a reliable connection for signal applications

Composed of robust PA 66 GF housing material for enhanced durability

Composed of robust PA 66 GF housing material for enhanced durability

Features a mating retention latch for secure connections

Features a mating retention latch for secure connections

Designed for operational temperatures ranging from -40 to 120 °C

Designed for operational temperatures ranging from -40 to 120 °C

Incorporates inner alignment features to prevent misalignment during connection

Incorporates inner alignment features to prevent misalignment during connection

Ensures compatibility with a range of related components and accessories

Ensures compatibility with a range of related components and accessories

Provides easy installation with through-hole solder termination method

Provides easy installation with through-hole solder termination method

Sustainably manufactured to comply with EU RoHS regulations

Sustainably manufactured to comply with EU RoHS regulations