Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 4 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

The Phoenix Contact PCB header is engineered for seamless integration into your electronic projects, delivering robust data transmission and versatile connection options. With a compact design tailored for through-hole reflow technology, this component excels in multi-row configurations, maximising space and efficiency on your circuit board. Its superior construction, featuring a reliable Cu alloy contact material, guarantees minimal resistance and exceptional performance under high load conditions. Ideal for those seeking flexibility, this header supports various connection techniques while maintaining stringent compliance with environmental standards, ensuring a reliable choice for eco-conscious applications. With its user-friendly design and excellent durability, the PCB header is set to meet the modern demands of electronic device design.

The Phoenix Contact PCB header is engineered for seamless integration into your electronic projects, delivering robust data transmission and versatile connection options. With a compact design tailored for through-hole reflow technology, this component excels in multi-row configurations, maximising space and efficiency on your circuit board. Its superior construction, featuring a reliable Cu alloy contact material, guarantees minimal resistance and exceptional performance under high load conditions. Ideal for those seeking flexibility, this header supports various connection techniques while maintaining stringent compliance with environmental standards, ensuring a reliable choice for eco-conscious applications. With its user-friendly design and excellent durability, the PCB header is set to meet the modern demands of electronic device design.

Designed for optimal integration into SMT soldering processesVertical connection facilitates efficient multi-row arrangements on PCBsCompatible with devices requiring diverse connection technologiesOffers conductor connections on multiple levels to maximise contact densityComplies with WEEE/RoHS regulations, ensuring an eco-friendly choicePacked in cardboard, promoting sustainable packaging practicesMoisture Sensitive Level 1, providing dependable performance in various environmentsBlack insulating material enhances aesthetic appeal and durabilityBacked by comprehensive user documentation for straightforward installation

Designed for optimal integration into SMT soldering processes

Vertical connection facilitates efficient multi-row arrangements on PCBs

Vertical connection facilitates efficient multi-row arrangements on PCBs

Compatible with devices requiring diverse connection technologies

Compatible with devices requiring diverse connection technologies

Offers conductor connections on multiple levels to maximise contact density

Offers conductor connections on multiple levels to maximise contact density

Complies with WEEE/RoHS regulations, ensuring an eco-friendly choice

Complies with WEEE/RoHS regulations, ensuring an eco-friendly choice

Packed in cardboard, promoting sustainable packaging practices

Packed in cardboard, promoting sustainable packaging practices

Moisture Sensitive Level 1, providing dependable performance in various environments

Moisture Sensitive Level 1, providing dependable performance in various environments

Black insulating material enhances aesthetic appeal and durability

Black insulating material enhances aesthetic appeal and durability

Backed by comprehensive user documentation for straightforward installation

Backed by comprehensive user documentation for straightforward installation