Phoenix Contact MCDN Series Solder PCB Header, 12 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

The Phoenix Contact PCB Header features a standard pin connector pattern alignment with no locking mechanism. It has no additional mounting method and is packed in cardboard for storage. The mounting type includes THR soldering and wave soldering. The pin layout follows linear pinning, and the contact material is copper alloy. The surface characteristics are tin-plated for enhanced durability, while the insulating material is LCP (Liquid Crystal Polymer) for electrical insulation.

The Phoenix Contact PCB Header features a standard pin connector pattern alignment with no locking mechanism. It has no additional mounting method and is packed in cardboard for storage. The mounting type includes THR soldering and wave soldering. The pin layout follows linear pinning, and the contact material is copper alloy. The surface characteristics are tin-plated for enhanced durability, while the insulating material is LCP (Liquid Crystal Polymer) for electrical insulation.

Designed for integration into the SMT soldering processMaximum flexibility when it comes to device design which is one header for connectors with different connection technologiesConductor connection on several levels enables higher contact density

Designed for integration into the SMT soldering process

Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies

Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies

Conductor connection on several levels enables higher contact density

Conductor connection on several levels enables higher contact density