Phoenix Contact DMC Series Straight Surface PCB Header, 10 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

The Phoenix Contact PCB header is designed to integrate seamlessly into SMT processes, offering enhanced performance and reliability for modern electronic applications. Engineered for superior contact quality, it features gold-plated contacts that ensure stable transfer quality over extended periods. With a compact design that accommodates high contact density, this product meets the demands of contemporary circuit board designs. Whether you're assembling complex electronic devices or standard applications, this header stands out for its robust capabilities and technical specifications, making it a reliable choice for engineers and manufacturers alike.

The Phoenix Contact PCB header is designed to integrate seamlessly into SMT processes, offering enhanced performance and reliability for modern electronic applications. Engineered for superior contact quality, it features gold-plated contacts that ensure stable transfer quality over extended periods. With a compact design that accommodates high contact density, this product meets the demands of contemporary circuit board designs. Whether you're assembling complex electronic devices or standard applications, this header stands out for its robust capabilities and technical specifications, making it a reliable choice for engineers and manufacturers alike.

Gold-plated contacts support long-term stability and reliabilityCustomised for smooth integration in the SMT processHigher contact density achieved through multi-level conductor connectionDesigned with standard linear pad geometry for efficient solderingEnvironmental compliance with WEEE and RoHS standardsFacilitates efficient assembly with a SMD soldering mount typeDurable housing material capable of withstanding harsh conditionsRated for a wide range of ambient temperatures, ensuring versatile use

Gold-plated contacts support long-term stability and reliability

Customised for smooth integration in the SMT process

Customised for smooth integration in the SMT process

Higher contact density achieved through multi-level conductor connection

Higher contact density achieved through multi-level conductor connection

Designed with standard linear pad geometry for efficient soldering

Designed with standard linear pad geometry for efficient soldering

Environmental compliance with WEEE and RoHS standards

Environmental compliance with WEEE and RoHS standards

Facilitates efficient assembly with a SMD soldering mount type

Facilitates efficient assembly with a SMD soldering mount type

Durable housing material capable of withstanding harsh conditions

Durable housing material capable of withstanding harsh conditions

Rated for a wide range of ambient temperatures, ensuring versatile use

Rated for a wide range of ambient temperatures, ensuring versatile use