Phoenix Contact DMC Series Straight Surface PCB Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

The Phoenix Contact high-quality PCB header is designed for enhanced connectivity in modern electronic applications. Offering an efficient solution with a compact design, this component integrates seamlessly into surface-mount technology (SMT) processes, ensuring reliable connections. Engineered for performance, it features gold-plated contacts that maintain excellent transfer quality over time. The product range DMC 0.5/-G1-SMD reflects the commitment to precision and innovation, catering to various needs within complex electronic systems. With its robust specifications and user-friendly characteristics, it stands as a vital component for effective and sustainable connection.

The Phoenix Contact high-quality PCB header is designed for enhanced connectivity in modern electronic applications. Offering an efficient solution with a compact design, this component integrates seamlessly into surface-mount technology (SMT) processes, ensuring reliable connections. Engineered for performance, it features gold-plated contacts that maintain excellent transfer quality over time. The product range DMC 0.5/-G1-SMD reflects the commitment to precision and innovation, catering to various needs within complex electronic systems. With its robust specifications and user-friendly characteristics, it stands as a vital component for effective and sustainable connection.

Gold-plated contacts provide enhanced long-term stabilityDesigned for ease of integration within SMT processesOptimises contact density through multi-level conductor connectionsManufactured with compliance to WEEE/RoHS standardsOffers high reliability with a low contact resistanceAccommodates a multitude of applications with its versatile designEnables straightforward assembly with linear pad geometryTested for environmental conditions to ensure durability and performance

Gold-plated contacts provide enhanced long-term stability

Designed for ease of integration within SMT processes

Designed for ease of integration within SMT processes

Optimises contact density through multi-level conductor connections

Optimises contact density through multi-level conductor connections

Manufactured with compliance to WEEE/RoHS standards

Manufactured with compliance to WEEE/RoHS standards

Offers high reliability with a low contact resistance

Offers high reliability with a low contact resistance

Accommodates a multitude of applications with its versatile design

Accommodates a multitude of applications with its versatile design

Enables straightforward assembly with linear pad geometry

Enables straightforward assembly with linear pad geometry

Tested for environmental conditions to ensure durability and performance

Tested for environmental conditions to ensure durability and performance