Samtec TST Series Right Angle Through Hole PCB Header, 6 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

The Samtec IDC headers is designed to deliver robust connectivity solutions tailored for various applications. With a unique combination of surface mount and through-hole features, this product ensures a secure connection for high-density configurations. Crafted from high-quality materials, it exhibits remarkable durability while maintaining exceptional electrical performance, making it an ideal choice for modern electronic devices. This component stands out with its versatile design, accommodating various row configurations and plating options, ensuring seamless integration into your assembly needs.

The Samtec IDC headers is designed to deliver robust connectivity solutions tailored for various applications. With a unique combination of surface mount and through-hole features, this product ensures a secure connection for high-density configurations. Crafted from high-quality materials, it exhibits remarkable durability while maintaining exceptional electrical performance, making it an ideal choice for modern electronic devices. This component stands out with its versatile design, accommodating various row configurations and plating options, ensuring seamless integration into your assembly needs.

Designed for high density applications, providing excellent connectivityFlexible mounting options suited for both surface and through hole requirementsConstructed from durable materials to ensure long lasting performanceMaximises space in electronic assemblies with its compact design

Designed for high density applications, providing excellent connectivity

Flexible mounting options suited for both surface and through hole requirements

Flexible mounting options suited for both surface and through hole requirements

Constructed from durable materials to ensure long lasting performance

Constructed from durable materials to ensure long lasting performance

Maximises space in electronic assemblies with its compact design

Maximises space in electronic assemblies with its compact design