Samtec UDF6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 2 Row, Shrouded

The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.

The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.

PCIe 6.0/CXL 3.1 capableWeld tabs included for a secure connection to the boardPolarized guide posts for blind matingOptional alignment pins0.635 mm signal pitch

PCIe 6.0/CXL 3.1 capable

Weld tabs included for a secure connection to the board

Weld tabs included for a secure connection to the board

Polarized guide posts for blind mating

Polarized guide posts for blind mating

Optional alignment pins

Optional alignment pins

0.635 mm signal pitch

0.635 mm signal pitch