Molex 46207 Series Vertical Through Hole PCB Header, 4 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

The Molex Mini Fit Jr. Header designed for effective board-to-board and wire-to-board connectivity. Engineered for versatility, this component supports a maximum current of 13.0A per contact and is rated for 600V AC (RMS)/DC, making it Ideal for various power applications. With its black high-temperature thermoplastic housing and dual-row, vertical configuration, the Mini-Fit Jr. promises both performance efficiency and durability. It also excels in thermal management, operating seamlessly within a temperature range of -40° to +105°C. The header features fully shrouded contacts for added safety and a secure locking mechanism to ensure robust connections.

The Molex Mini Fit Jr. Header designed for effective board-to-board and wire-to-board connectivity. Engineered for versatility, this component supports a maximum current of 13.0A per contact and is rated for 600V AC (RMS)/DC, making it Ideal for various power applications. With its black high-temperature thermoplastic housing and dual-row, vertical configuration, the Mini-Fit Jr. promises both performance efficiency and durability. It also excels in thermal management, operating seamlessly within a temperature range of -40° to +105°C. The header features fully shrouded contacts for added safety and a secure locking mechanism to ensure robust connections.

Fully shrouded contacts provide additional safety during operationRobust locking mechanism prevents accidental disconnectionsDesigned for compatibility with Mini-Fit TPA2 and Sigma receptaclesMaintains excellent performance with a durability rating of 30 mating cyclesIdeal for wire-to-board and board-to-board applications, expanding its utility

Fully shrouded contacts provide additional safety during operationRobust locking mechanism prevents accidental disconnectionsDesigned for compatibility with Mini-Fit TPA2 and Sigma receptaclesMaintains excellent performance with a durability rating of 30 mating cyclesIdeal for wire-to-board and board-to-board applications, expanding its utility