Molex 44428 Series Right Angle Through Hole PCB Header, 24 Contact(s), 3 mm Pitch, 2 Row, Shrouded

The Molex Micro-Fit BMI Header is designed for seamless board-to-board and wire-to-board applications, offering a right-angle configuration that aids in space-constrained environments. This dual-row connector accommodates 24 circuits, ensuring reliable and efficient connections. With a sturdy snap-in plastic peg PCB lock and a tin plating finish, it guarantees a Durable and secure fit. The header’s maximum voltage rating of 600V and current capacity of 8.5A make it suitable for a wide range of electronic applications, while its temperature range of -40° to +105°C ensures reliable performance under various conditions. Featuring a user-friendly design with a recommended PCB thickness of 1.60mm, it simplifies assembly without compromising on quality.

The Molex Micro-Fit BMI Header is designed for seamless board-to-board and wire-to-board applications, offering a right-angle configuration that aids in space-constrained environments. This dual-row connector accommodates 24 circuits, ensuring reliable and efficient connections. With a sturdy snap-in plastic peg PCB lock and a tin plating finish, it guarantees a Durable and secure fit. The header’s maximum voltage rating of 600V and current capacity of 8.5A make it suitable for a wide range of electronic applications, while its temperature range of -40° to +105°C ensures reliable performance under various conditions. Featuring a user-friendly design with a recommended PCB thickness of 1.60mm, it simplifies assembly without compromising on quality.

Temperature range supports extreme conditions from -40° to +105°CDesigned with a recommended PCB thickness of 1.60mm for easy integrationFully shrouded structure ensures reliable mating and reduces the risk of misalignmentWAVE process capability maximizes compatibility with lead-free soldering requirementsDurability of up to 30 mating cycles enhances product longevity

Temperature range supports extreme conditions from -40° to +105°CDesigned with a recommended PCB thickness of 1.60mm for easy integrationFully shrouded structure ensures reliable mating and reduces the risk of misalignmentWAVE process capability maximizes compatibility with lead-free soldering requirementsDurability of up to 30 mating cycles enhances product longevity