Molex 21039 Series FFC Ribbon Cable, 26-Way, 1mm Pitch, 152mm Length, FFC Connector to FFC Connector

The Molex FFC Jumper is engineered for effective interconnections in compact spaces, featuring opposite side contacts (Type D) for seamless integration. With a 1.00mm pitch and 26 circuits, this jumper provides reliable performance across various applications. Crafted from high-quality materials, it ensures robust electrical connectivity and is ideal for environments demanding flexibility and reliability. The included replacement part number offers convenience for sourcing and maintenance, making it a versatile choice for engineers and designers alike.

The Molex FFC Jumper is engineered for effective interconnections in compact spaces, featuring opposite side contacts (Type D) for seamless integration. With a 1.00mm pitch and 26 circuits, this jumper provides reliable performance across various applications. Crafted from high-quality materials, it ensures robust electrical connectivity and is ideal for environments demanding flexibility and reliability. The included replacement part number offers convenience for sourcing and maintenance, making it a versatile choice for engineers and designers alike.

Opposite side contacts optimise space requirements within devices1mm pitch aligns with standard flat flex cable applications for compatibilityUtilises flat flex cable type for added flexibility and adaptability in installationsCompatible with a maximum voltage of 30V, ensuring safety and reliabilitySupplied in a durable bag packaging, for easy handling and storageLow electro migration potential due to the tin plating enhances longevityDesigned for use with specific soldering processes, ensuring consistent bonding

Opposite side contacts optimise space requirements within devices1mm pitch aligns with standard flat flex cable applications for compatibilityUtilises flat flex cable type for added flexibility and adaptability in installationsCompatible with a maximum voltage of 30V, ensuring safety and reliabilitySupplied in a durable bag packaging, for easy handling and storageLow electro migration potential due to the tin plating enhances longevityDesigned for use with specific soldering processes, ensuring consistent bonding