Molex zSFP+ I/O Connector Female 16-Port 320-Position, 172501-8002

The Molex zSFP+ Stacked Ganged Assembly with Metal Spring Fingers is expertly designed for high-speed I/O connector applications featuring a compact two-by-eight configuration that optimises airflow. This product effectively accommodates 320 circuits making it ideal for advanced electronic integration. With its robust construction that includes a high-performance alloy and thermoplastic materials this assembly ensures reliable performance across a broad operating temperature range of -40° to +85°C. The unique engineering incorporates EMI shielding to enhance data integrity while maintaining a maximum data rate of 28.0 Gbps. Accurately tailored for module to board applications this versatile receptacle guarantees ease of installation and secure connectivity.

The Molex zSFP+ Stacked Ganged Assembly with Metal Spring Fingers is expertly designed for high-speed I/O connector applications featuring a compact two-by-eight configuration that optimises airflow. This product effectively accommodates 320 circuits making it ideal for advanced electronic integration. With its robust construction that includes a high-performance alloy and thermoplastic materials this assembly ensures reliable performance across a broad operating temperature range of -40° to +85°C. The unique engineering incorporates EMI shielding to enhance data integrity while maintaining a maximum data rate of 28.0 Gbps. Accurately tailored for module to board applications this versatile receptacle guarantees ease of installation and secure connectivity.

320 circuits for enhanced connection capacityEngineered for module to board applications providing flexibilityIncludes EMI fingers for superior shielding performanceConstructed with high-performance thermoplastic and alloy materials for durabilityRight angle orientation simplifies installation in compact spacesDesigned to withstand 100 mating cycles which ensuring long-term usabilityPCB retention features enhance stability in electronic assembliesTray packaging facilitates easy handling and minimises damage during transit

320 circuits for enhanced connection capacityEngineered for module to board applications providing flexibilityIncludes EMI fingers for superior shielding performanceConstructed with high-performance thermoplastic and alloy materials for durabilityRight angle orientation simplifies installation in compact spacesDesigned to withstand 100 mating cycles which ensuring long-term usabilityPCB retention features enhance stability in electronic assembliesTray packaging facilitates easy handling and minimises damage during transit