Molex 42002 Series Vertical Through Hole PCB Header, 4 Contact(s), 6.35 mm Pitch, 1 Row, Shrouded

The Molex Micro-Fit+ Vertical Header is expertly designed to provide robust connectivity for power and wire-to-board applications. This component serves as a reliable interface with its dual-row, 22-circuit configuration, and a 3.00mm pitch. The header’s high copper alloy construction and tin plating ensure superior conductivity and durability, making it ideal for demanding environments. With a vertical orientation, it optimises space on PCBs while maintaining a reliable connection that supports a maximum current of 12.5A and voltage of 600V AC/DC. Additionally, its glow-wire capability enhances safety in applications susceptible to high temperatures, catering to diverse industry needs.

The Molex Micro-Fit+ Vertical Header is expertly designed to provide robust connectivity for power and wire-to-board applications. This component serves as a reliable interface with its dual-row, 22-circuit configuration, and a 3.00mm pitch. The header’s high copper alloy construction and tin plating ensure superior conductivity and durability, making it ideal for demanding environments. With a vertical orientation, it optimises space on PCBs while maintaining a reliable connection that supports a maximum current of 12.5A and voltage of 600V AC/DC. Additionally, its glow-wire capability enhances safety in applications susceptible to high temperatures, catering to diverse industry needs.

Dual row design with 22 circuits maximises connection pointsTin plating ensures long lasting conductivity and corrosion resistanceHigh copper alloy construction enhances current handling capabilitiesGlow wire capable feature increases safety in high temperature applicationsVertical orientation optimises space on printed circuit boardsDurable design withstands up to 25 mating cycles for reliable performanceLocking mechanism to mating part ensures secure connections

Dual row design with 22 circuits maximises connection points

Tin plating ensures long lasting conductivity and corrosion resistance

Tin plating ensures long lasting conductivity and corrosion resistance

High copper alloy construction enhances current handling capabilities

High copper alloy construction enhances current handling capabilities

Glow wire capable feature increases safety in high temperature applications

Glow wire capable feature increases safety in high temperature applications

Vertical orientation optimises space on printed circuit boards

Vertical orientation optimises space on printed circuit boards

Durable design withstands up to 25 mating cycles for reliable performance

Durable design withstands up to 25 mating cycles for reliable performance

Locking mechanism to mating part ensures secure connections

Locking mechanism to mating part ensures secure connections