Molex 1717 Series Vertical Edge Connector, Edge Mount, 118-Contacts, 0.8mm Pitch, Surface Mount Termination

The Molex EdgeLine High Speed Connector is engineered to deliver exceptional performance in high-speed data applications. This innovative connector supports data rates of over 20 Gbps within a compact 0.80mm pitch design making it ideal for environments where space and efficiency are paramount. With a robust vertical orientation and a PCB thickness of 1.57mm this connector is compatible with a variety of applications ensuring versatility and reliability. Its design features low-halogen materials that meet environmental compliance standards thereby enhancing its appeal for modern applications. Moreover the connector is equipped for extensive durability and reliability supporting up to 25 mating cycles ensuring longevity in demanding conditions.

The Molex EdgeLine High Speed Connector is engineered to deliver exceptional performance in high-speed data applications. This innovative connector supports data rates of over 20 Gbps within a compact 0.80mm pitch design making it ideal for environments where space and efficiency are paramount. With a robust vertical orientation and a PCB thickness of 1.57mm this connector is compatible with a variety of applications ensuring versatility and reliability. Its design features low-halogen materials that meet environmental compliance standards thereby enhancing its appeal for modern applications. Moreover the connector is equipped for extensive durability and reliability supporting up to 25 mating cycles ensuring longevity in demanding conditions.

Compact 0.80mm pitch allows for efficient space utilisationVertical orientation optimises integration in multi-layer PCBsDurable design rated for 25 mating cycles to ensure longevityManufactured from low-halogen materials compliant with environmental standardsCompatible with a PCB thickness of 1.57mm for versatile applicationsElectrical model and specifications available for precise implementationGuaranteed performance with maximum current per contact of 1.52AFeatures gold over nickel plating for enhanced connectivityPackaging type designed for efficient handling and storage in manufacturing environments

Compact 0.80mm pitch allows for efficient space utilisationVertical orientation optimises integration in multi-layer PCBsDurable design rated for 25 mating cycles to ensure longevityManufactured from low-halogen materials compliant with environmental standardsCompatible with a PCB thickness of 1.57mm for versatile applicationsElectrical model and specifications available for precise implementationGuaranteed performance with maximum current per contact of 1.52AFeatures gold over nickel plating for enhanced connectivityPackaging type designed for efficient handling and storage in manufacturing environments