Molex zSFP+ I/O Connector Receptacle 16-Port 320-Position, 170071-8011

The Molex zSFP+ stacked ganged assembly with elastomeric gasket designed to facilitate efficient module to board connectivity. This innovative connector featuring a 2-by-8 layout and 320 circuits is crucial for high-speed data transmission in modern electronic applications. With a robust construction that includes a high-performance alloy metal and a durable high-temperature thermoplastic resin this component ensures long-lasting performance under various operational conditions. Its female gender and right-angle orientation simplify installation while maintaining secure connections. Ideal for high-speed I/O applications this device stands out with its compliance to EU RoHS regulations and commitment to environmental standards.

The Molex zSFP+ stacked ganged assembly with elastomeric gasket designed to facilitate efficient module to board connectivity. This innovative connector featuring a 2-by-8 layout and 320 circuits is crucial for high-speed data transmission in modern electronic applications. With a robust construction that includes a high-performance alloy metal and a durable high-temperature thermoplastic resin this component ensures long-lasting performance under various operational conditions. Its female gender and right-angle orientation simplify installation while maintaining secure connections. Ideal for high-speed I/O applications this device stands out with its compliance to EU RoHS regulations and commitment to environmental standards.

Designed for high-speed data rates up to 28.0 GbpsConstructed with a high-performance alloy for enhanced durabilityAccommodates 320 circuits facilitating complex connectionsElastomeric gasket ensures reliable sealing and protectionSupports a maximum voltage of 30V AC for versatile applicationCompatible with through-hole compliant pin termination for easy installationIncludes features like PCB retention and locator for stable mountingManufactured to comply with EU RoHS and REACH SVHC standardsProvides a plating minim of 0.762μm for optimal conductivity

Designed for high-speed data rates up to 28.0 GbpsConstructed with a high-performance alloy for enhanced durabilityAccommodates 320 circuits facilitating complex connectionsElastomeric gasket ensures reliable sealing and protectionSupports a maximum voltage of 30V AC for versatile applicationCompatible with through-hole compliant pin termination for easy installationIncludes features like PCB retention and locator for stable mountingManufactured to comply with EU RoHS and REACH SVHC standardsProvides a plating minim of 0.762μm for optimal conductivity