Molex 0.35mm Pitch Connector Backplane Connector, Receptacle, Vertical, 14 Column, 56 Way, 170390

The Molex unguided mezzanine connector designed to facilitate efficient and high-performance connectivity in compact assemblies. This versatile connector features a tailored design that accommodates up to 56 pairs of signals, ensuring reliable data transfer in space-constrained environments. Crafted from liquid crystal polymer and high-performance copper alloy, it aligns with the highest standards of durability and thermal stability. Its selective gold finish in the contact area combined with matte tin on PCB tails guarantees optimal performance and longevity, making it an ideal choice for applications requiring robustness and precision.

The Molex unguided mezzanine connector designed to facilitate efficient and high-performance connectivity in compact assemblies. This versatile connector features a tailored design that accommodates up to 56 pairs of signals, ensuring reliable data transfer in space-constrained environments. Crafted from liquid crystal polymer and high-performance copper alloy, it aligns with the highest standards of durability and thermal stability. Its selective gold finish in the contact area combined with matte tin on PCB tails guarantees optimal performance and longevity, making it an ideal choice for applications requiring robustness and precision.

Material construction includes liquid crystal polymer for excellent thermal stabilityHigh performance copper alloy terminals ensure dependable connectivitySelective gold finish in contact areas enhances electrical performanceMatte tin on PCB tails optimises solderabilityAccommodates 56 differential pairs for ample signal transmissionEach signal wafer comprises two columns of terminals for space efficiencyConforms to Class B cosmetic specifications for high quality standardsMeets rigorous performance specifications for reliability in demanding applicationsIncludes detailed documentation for installation and compatibility guidance

Material construction includes liquid crystal polymer for excellent thermal stabilityHigh performance copper alloy terminals ensure dependable connectivitySelective gold finish in contact areas enhances electrical performanceMatte tin on PCB tails optimises solderabilityAccommodates 56 differential pairs for ample signal transmissionEach signal wafer comprises two columns of terminals for space efficiencyConforms to Class B cosmetic specifications for high quality standardsMeets rigorous performance specifications for reliability in demanding applicationsIncludes detailed documentation for installation and compatibility guidance