Molex 215760 Series Right Angle Through Hole PCB Header, 7 Contact(s), 3 mm Pitch, 1 Row, Shrouded

The Molex Micro-Fit+ Right-Angle Header is an advanced interconnect solution designed for efficient power distribution in various electronic applications. This header features a robust single-row configuration with seven circuits, making it ideal for use in environments requiring space-saving designs. The 3.00mm pitch optimises board space while ensuring reliable connection integrity, and the matte tin plating contributes to enhanced conductivity. The Micro-Fit+ design is glow-wire capable, allowing it to perform safely in high-temperature conditions, while its black liquid crystal polymer construction offers durability and resistance to various environmental factors. Whether for power or wire-to-board applications, this header is built to meet the rigorous demands of modern electronic systems.

The Molex Micro-Fit+ Right-Angle Header is an advanced interconnect solution designed for efficient power distribution in various electronic applications. This header features a robust single-row configuration with seven circuits, making it ideal for use in environments requiring space-saving designs. The 3.00mm pitch optimises board space while ensuring reliable connection integrity, and the matte tin plating contributes to enhanced conductivity. The Micro-Fit+ design is glow-wire capable, allowing it to perform safely in high-temperature conditions, while its black liquid crystal polymer construction offers durability and resistance to various environmental factors. Whether for power or wire-to-board applications, this header is built to meet the rigorous demands of modern electronic systems.

Glow wire capable design enhances safety in high temperature environmentsBlack resin construction delivers durability and resistance to external factorsMatte tin plating ensures excellent conductivity and reliabilitySingle row, seven circuit configuration optimises space in compact designsPCB retention feature provides secure mounting on the boardIdeal for power and wire to board applications, enhancing system performanceUtilises high copper alloy for effective electrical conductivity

Glow wire capable design enhances safety in high temperature environments

Black resin construction delivers durability and resistance to external factors

Black resin construction delivers durability and resistance to external factors

Matte tin plating ensures excellent conductivity and reliability

Matte tin plating ensures excellent conductivity and reliability

Single row, seven circuit configuration optimises space in compact designs

Single row, seven circuit configuration optimises space in compact designs

PCB retention feature provides secure mounting on the board

PCB retention feature provides secure mounting on the board

Ideal for power and wire to board applications, enhancing system performance

Ideal for power and wire to board applications, enhancing system performance

Utilises high copper alloy for effective electrical conductivity

Utilises high copper alloy for effective electrical conductivity