Molex zSFP+ I/O Connector Receptacle 8-Port 160-Position, 171224-4011

The Molex zSFP+ Stacked Ganged Assembly is engineered for high-performance connectivity in advanced electronic applications. Designed as a 2-by-4 receptacle featuring metal spring fingers and four light pipes this connector accommodates up to 160 circuits enabling seamless data transfer at high speeds. With a robust construction the assembly ensures excellent durability making it suitable for demanding environments. It supports reliable module to board applications while maintaining strict compliance with industry standards ensuring both safety and efficiency in your electronic designs.

The Molex zSFP+ Stacked Ganged Assembly is engineered for high-performance connectivity in advanced electronic applications. Designed as a 2-by-4 receptacle featuring metal spring fingers and four light pipes this connector accommodates up to 160 circuits enabling seamless data transfer at high speeds. With a robust construction the assembly ensures excellent durability making it suitable for demanding environments. It supports reliable module to board applications while maintaining strict compliance with industry standards ensuring both safety and efficiency in your electronic designs.

Supports a maximum data rate of 28.0 Gbps which ensuring rapid signal transmissionDesigned with EMI fingers for effective shielding against electromagnetic interferenceSustainably constructed from high-performance alloy optimised for long-lasting useHas a durable mating cycle rating of 100 promising reliability over extended usageUtilises lead-free processing capabilities aligning with modern environmental standardsIncludes PCB retention features for enhanced stability in circuit designsPackaged in trays facilitating easy handling and storage during manufacturing processes

Supports a maximum data rate of 28.0 Gbps which ensuring rapid signal transmissionDesigned with EMI fingers for effective shielding against electromagnetic interferenceSustainably constructed from high-performance alloy optimised for long-lasting useHas a durable mating cycle rating of 100 promising reliability over extended usageUtilises lead-free processing capabilities aligning with modern environmental standardsIncludes PCB retention features for enhanced stability in circuit designsPackaged in trays facilitating easy handling and storage during manufacturing processes