Molex 216571 Series Vertical Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

The Molex Micro-Fit+ Vertical Header designed to facilitate efficient power and signal connections within various electronic applications. This robust header, with a 3.00mm pitch and three circuits, ensures reliable performance in demanding environments, thanks to its glow-wire capability. Constructed from high copper alloy and featuring a matte tin plated termination, it combines durability with excellent electrical characteristics. Operating over a temperature range of -40° to +125°C, this component is ideal for long-lasting connections. Its one-row design enhances space optimisation on PCBs, while features like PCB retention and compatibility with standard housings make it an essential choice for users aiming for reliability and efficiency in their wire-to-board connections.

The Molex Micro-Fit+ Vertical Header designed to facilitate efficient power and signal connections within various electronic applications. This robust header, with a 3.00mm pitch and three circuits, ensures reliable performance in demanding environments, thanks to its glow-wire capability. Constructed from high copper alloy and featuring a matte tin plated termination, it combines durability with excellent electrical characteristics. Operating over a temperature range of -40° to +125°C, this component is ideal for long-lasting connections. Its one-row design enhances space optimisation on PCBs, while features like PCB retention and compatibility with standard housings make it an essential choice for users aiming for reliability and efficiency in their wire-to-board connections.

Glow wire capable for enhanced safety in structural applicationsDesigned with a vertical orientation for compact PCB layoutsRobust one row, three circuit design maximises space efficiencyConstructed with high copper alloy for superior conductivityMatte tin plating for improved solderability and corrosion resistanceDurability rating of 200 mating cycles ensures long term reliabilityUtilises lead free solder process capability for eco friendly manufacturingLocking features to mating parts enhance connection stability

Glow wire capable for enhanced safety in structural applications

Designed with a vertical orientation for compact PCB layouts

Designed with a vertical orientation for compact PCB layouts

Robust one row, three circuit design maximises space efficiency

Robust one row, three circuit design maximises space efficiency

Constructed with high copper alloy for superior conductivity

Constructed with high copper alloy for superior conductivity

Matte tin plating for improved solderability and corrosion resistance

Matte tin plating for improved solderability and corrosion resistance

Durability rating of 200 mating cycles ensures long term reliability

Durability rating of 200 mating cycles ensures long term reliability

Utilises lead free solder process capability for eco friendly manufacturing

Utilises lead free solder process capability for eco friendly manufacturing

Locking features to mating parts enhance connection stability

Locking features to mating parts enhance connection stability