Molex 71308 Series Vertical Surface PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The Molex C-Grid Breakaway Header is expertly designed for seamless board-to-board and wire-to-board applications, ensuring reliable connectivity in electronic devices. Featuring a dual-row, vertical configuration with 14 circuits, it employs a precise 2.54mm pitch to facilitate optimal performance. This header is characterized by its durable construction, utilizing high-temperature thermoplastic resin, and is finished with a combination of gold and tin plating to enhance conductivity and longevity. Ideal for applications requiring robust connections, this component promises dependable electrical performance while maintaining a low halogen status, aligning with modern environmental standards.

The Molex C-Grid Breakaway Header is expertly designed for seamless board-to-board and wire-to-board applications, ensuring reliable connectivity in electronic devices. Featuring a dual-row, vertical configuration with 14 circuits, it employs a precise 2.54mm pitch to facilitate optimal performance. This header is characterized by its durable construction, utilizing high-temperature thermoplastic resin, and is finished with a combination of gold and tin plating to enhance conductivity and longevity. Ideal for applications requiring robust connections, this component promises dependable electrical performance while maintaining a low halogen status, aligning with modern environmental standards.

Designed without PCB locator pegs, allowing for flexible mounting optionsSurface mount design simplifies PCB assembly processesStackable configuration facilitates compact arrangements in multi-layer applicationsLow-halogen materials comply with stringent environmental and safety regulations

Designed without PCB locator pegs, allowing for flexible mounting options

Surface mount design simplifies PCB assembly processes

Surface mount design simplifies PCB assembly processes

Stackable configuration facilitates compact arrangements in multi-layer applications

Stackable configuration facilitates compact arrangements in multi-layer applications

Low-halogen materials comply with stringent environmental and safety regulations

Low-halogen materials comply with stringent environmental and safety regulations