Molex 43879 Series Vertical Through Hole PCB Header, 10 Contact(s), 4.20 mm Pitch, 2 Row, Shrouded

The Molex Mini-Fit BMI Header is a high-performance connector designed for robust applications requiring reliable board-to-board and power connections. Its dual-row configuration accommodates up to 10 circuits, ensuring versatility across various electronic systems while featuring compliant pin technology for enhanced reliability during mating. Constructed using high-temperature thermoplastic and featuring a black resin colours, this header is built to withstand challenging environments, making it suitable for diverse applications, such as PCB headers and receptacles. With a maximum voltage of 600V AC/DC and a current capacity of 8A per contact, this component is engineered for optimum electrical performance and longevity.

The Molex Mini-Fit BMI Header is a high-performance connector designed for robust applications requiring reliable board-to-board and power connections. Its dual-row configuration accommodates up to 10 circuits, ensuring versatility across various electronic systems while featuring compliant pin technology for enhanced reliability during mating. Constructed using high-temperature thermoplastic and featuring a black resin colours, this header is built to withstand challenging environments, making it suitable for diverse applications, such as PCB headers and receptacles. With a maximum voltage of 600V AC/DC and a current capacity of 8A per contact, this component is engineered for optimum electrical performance and longevity.

Handles up to 8A of current per contact, allowing for high-power applications30 mating cycles offer long-lasting performance and reduce maintenance needsVertical orientation optimizes space for PCB layout and design flexibilityIntegrated locking mechanism enhances connection integrity during operationPlated with tin for improved conductivity and corrosion resistance

Handles up to 8A of current per contact, allowing for high-power applications30 mating cycles offer long-lasting performance and reduce maintenance needsVertical orientation optimizes space for PCB layout and design flexibilityIntegrated locking mechanism enhances connection integrity during operationPlated with tin for improved conductivity and corrosion resistance