Molex 43650 Series Right Angle Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

The Molex Micro-Fit 3.0 Right-Angle Header is engineered to provide reliable connections for power and wire-to-board applications. With its innovative design featuring a 3.00mm pitch and three circuits, this single-row header ensures secure mating with PCB press-fit metal retention clips. The robust construction, including high-temperature thermoplastic resin, withstands harsh conditions, making it Ideal for various electronic applications. Compliance with international standards guarantees safe operation, while the glow-wire capAbility signifies its Ability to perform in high-temperature environments. This product's versatility and durAbility cater to the diverse needs of modern electronic designs.

The Molex Micro-Fit 3.0 Right-Angle Header is engineered to provide reliable connections for power and wire-to-board applications. With its innovative design featuring a 3.00mm pitch and three circuits, this single-row header ensures secure mating with PCB press-fit metal retention clips. The robust construction, including high-temperature thermoplastic resin, withstands harsh conditions, making it Ideal for various electronic applications. Compliance with international standards guarantees safe operation, while the glow-wire capAbility signifies its Ability to perform in high-temperature environments. This product's versatility and durAbility cater to the diverse needs of modern electronic designs.

Rated for a maximum current of 8.5A and voltage of 600VDurability of up to 30 mating cycles ensures long-term reliabilityLow-halogen materials enhance environmental compliancePCB locator and retention features facilitate easier assembly and secure placementsVersatile application potentials in power and wire-to-board configurations

Rated for a maximum current of 8.5A and voltage of 600VDurability of up to 30 mating cycles ensures long-term reliabilityLow-halogen materials enhance environmental compliancePCB locator and retention features facilitate easier assembly and secure placementsVersatile application potentials in power and wire-to-board configurations