TE Connectivity Guide Socket for use with MULTIGIG RT, RT 2 and RT 2R Connectors

TE Connectivity Multigig 9.0 VITA 46 Guide Modules

Multigig 9.0 VITA 46 guide modules made from zinc alloy with a silver finish. These 9.0 VITA 46 guide modules are right angle mounting and are used with the VITA 46 3U & 6U 9mm Daughtercard.For suitable guide pin see stock number 718-1645For suitable mounting screw see stock number 718-1654These Multigig 9.0 VITA 46 guide modules are available with a variety of key orientations, please see table for details

Multigig 9.0 VITA 46 guide modules made from zinc alloy with a silver finish. These 9.0 VITA 46 guide modules are right angle mounting and are used with the VITA 46 3U & 6U 9mm Daughtercard.For suitable guide pin see stock number 718-1645For suitable mounting screw see stock number 718-1654These Multigig 9.0 VITA 46 guide modules are available with a variety of key orientations, please see table for details

TE Connectivity Multigig RT Series

TE Connectivity Multigig RT Series

MultiGig is a new backplane interconnect family used in Vita 41 and Vita 46 applications that offers levels of flexibility and customization never before seen in the industry,The connectors in this innovatively flexible platform can be combined to provide the density, data throughput, and signal integrity required for any application in today's computer, communications, military, medical, or industrial control industries.

MultiGig is a new backplane interconnect family used in Vita 41 and Vita 46 applications that offers levels of flexibility and customization never before seen in the industry,The connectors in this innovatively flexible platform can be combined to provide the density, data throughput, and signal integrity required for any application in today's computer, communications, military, medical, or industrial control industries.

Customizable impedance matched printed circuit wafer interface Inverse sex backplane connector system with “pinless” interface Superior crosstalk performance Optimized footprints for signal integrity and ease of board design Utilizes a .022 inch diameter via for lower cost board fabrication Three levels of signal contact sequencing Telcordia / Bellcore Compliant Durability rated for 250 Cycles

Customizable impedance matched printed circuit wafer interface Inverse sex backplane connector system with “pinless” interface Superior crosstalk performance Optimized footprints for signal integrity and ease of board design Utilizes a .022 inch diameter via for lower cost board fabrication Three levels of signal contact sequencing Telcordia / Bellcore Compliant Durability rated for 250 Cycles