Samtec SEAF Series Straight Surface Mount PCB Socket, 160-Contact, 8-Row, 1.27mm Pitch, Solder Termination

1.27mm SEARAY™ Series Interconnects

SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.

SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.

Various rows high density connectors suitable for board stacking applications Stack height dependant upon SEAF/SEAM combination from 7 mmContact resistance: 5.5 mΩContact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area

Various rows high density connectors suitable for board stacking applications Stack height dependant upon SEAF/SEAM combination from 7 mmContact resistance: 5.5 mΩContact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area